Services

Our Services

Comprehensive electronics manufacturing services designed for high-reliability applications across defense, medical, aerospace, and industrial sectors.

Populated motherboard mounted in an automated BGA rework station with overhead heating head

BGA Rework & Reballing

Removal, replacement, and reballing of ball-grid-array packages on populated boards. We handle fine-pitch BGAs, micro-BGAs, and high-density assemblies, including the rework that comes with first-article boards, field returns, and qualification builds.

What's included

  • BGA removal and site preparation
  • Manual and stencil-based reballing
  • Reattachment with controlled reflow profiles
  • Pre- and post-rework X-ray inspection
  • Adjacent-component protection during rework
  • Documented process records per board

Typical applications

Used for prototype debug, failure-recovery on production boards, qualification rebuilds, and lifecycle extension on legacy assemblies in regulated industries.

Standards: Workmanship aligned with IPC-7711/7721 (Rework, Modification, and Repair of Electronic Assemblies) and IPC-A-610 acceptability criteria.

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Engineers at a workstation reviewing PCB designs on monitors with organized component bins on the bench

Component Sourcing & Kitting

End-to-end material handling for production-ready builds. We source authorized components, kit them against your BOM, prep leads, and program devices so your build line starts with a complete, verified package.

What's included

  • Authorized-distributor sourcing with date-code review
  • BOM kitting against revision-controlled lists
  • Lead forming, trimming, and tinning
  • Device programming (microcontrollers, EEPROMs, configuration ICs)
  • ESD-safe packaging and labeling
  • Material handling and short-term staging

Typical applications

Suited for low-to-mid volume contract manufacturing, prototype runs that need traceable sourcing, and qualification builds where component provenance matters.

Standards: Components handled per IPC/JEDEC J-STD-033 moisture-sensitivity practice and ESD-safe procedures throughout staging.

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Close-up of a soldering iron tip and precision tweezers reworking a fine-pitch surface-mount chip on a green PCB

PCBA Rework & Testing

Manual and assisted rework on populated PCBAs across through-hole, surface-mount, and mixed-technology boards. Combined with X-ray inspection and functional testing, our rework process turns problem boards into production-quality assemblies.

What's included

  • Manual SMT rework (resistors, capacitors, ICs, fine-pitch QFNs)
  • Through-hole component replacement and rework
  • Mixed-technology assemblies and dual-side reflow
  • X-ray imaging for hidden joints and BGA inspection
  • Functional and continuity testing per customer test plan
  • Defect classification and root-cause notes

Typical applications

Common across aerospace, medical, automotive, and industrial assemblies. Suited for prototype-to-pilot transitions, field returns, or production debug that demand careful, traceable rework.

Standards: Rework performed to IPC-7711/7721 and inspected against IPC-A-610 Class 2 or Class 3 as specified.

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Row of completed box-build assemblies on the production line with technicians working in the background

Box Build and Assembly Support

Higher-level assembly that takes a populated PCBA into a finished, testable unit. Mechanical fastening, harnessing, adhesive application, underfill, and final integration. Processed and inspected in a controlled environment.

What's included

  • Mechanical assembly and chassis integration
  • Cable and harness installation
  • Underfill application and curing
  • Adhesive bonding, potting, and gasket installation
  • Labeling, serialization, and packaging
  • Final-unit inspection and continuity checks

Typical applications

Used by customers shipping finished sub-assemblies for medical devices, industrial controls, and aerospace electronics where the deliverable is a complete, ready-to-install module rather than just a board.

Standards: Assembly inspected against IPC-A-620 (Cable, Wire, Harness Assemblies) where applicable, plus customer-supplied work instructions.

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Conformal coating spray application on circuit board

Conformal Coating

Application, inspection, and rework of protective conformal coatings: acrylic, urethane, and silicone. Applied selectively or fully, with documented thickness and cure verification.

What's included

  • Acrylic, urethane, and silicone coating application
  • Selective masking of connectors and test points
  • Spray, brush, and dip application as appropriate
  • Cure verification and thickness checks
  • UV-fluorescent inspection of coverage
  • Coating rework, removal, and re-coating

Typical applications

Boards destined for harsh-environment, moisture-exposed, or vibration-prone applications across aerospace, automotive, and outdoor industrial electronics.

Standards: Coating applied and inspected per IPC-A-610 conformal coating criteria, with thickness ranges referenced to IPC-CC-830 where called out.

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Engineering team reviewing a populated circuit board assembly together at a workbench

Engineering Support and Process Consulting

Process optimization, DFM and DFA, and technical guidance to improve reliability and production efficiency.

What's included

  • Design-for-Manufacturability (DFM) review
  • Design-for-Assembly (DFA) review
  • Failure analysis on returned or non-conforming boards
  • Quality audits and process documentation
  • Pilot-to-production process development
  • Test-strategy and inspection-criteria review

Typical applications

Useful before a first build (catch issues at quote stage), during qualification (validate the process), and after field returns (find the root cause). Particularly valuable for teams transitioning a design from prototype to volume.

Standards: Reviews referenced against IPC-A-610 acceptability, IPC-7711/7721 rework guidelines, and J-STD-001 soldering requirements as applicable.

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